The Lazer Leap

Diamond Sawing, Slicing & Coring, cutting, Blocking Fancy Shape, 3D Shaping

Introducing LAZER LEAP by STPL – a revolutionary diamond processing solution that seamlessly merges cutting-edge technology with refined design. Its compact and sleek form redefines innovation in your workspace. LAZER LEAP excels in precision diamond sawing, crafting impeccable cuts with unmatched accuracy. Enhanced by MagikCut™ technology, it sets new standards, minimizing diamond breakage, weight loss, and delivering a flawlessly smooth surface finish. LAZER LEAP transcends expectations, embodying the future of diamond processing where form meets function, and innovation meets excellence – a testament to precision, efficiency, and a touch of modern sophistication in every operation.

Compatible with Robomatic 3D Shaping

Upgrade your LAZER LEAP experience with the 'ROBOMATIC'. Achieve precision in diamond shaping, especially round cuts, with excellence in quality, smooth surfaces, and accurate shapes. Experience efficiency as 'ROBOMATIC' seamlessly automates the shaping process, handling up to 600 diamonds on the conveyor belt. Elevate your diamond processing with LAZER LEAP and 'ROBOMATIC.'

Key Features

Compact and Sleek Design
LAZER LEAP boasts a space-efficient and stylish design, seamlessly integrating innovation into your workspace.

Precise Diamond Sawing
Achieve unparalleled precision in diamond sawing operations with LAZER LEAP, ensuring meticulous and accurate cuts every time.

Magical MagikCut™
Experience the magic of MagikCut™ technology, enhancing cutting-edge capabilities for optimal performance in diamond processing.

Less Diamond Breakage
LAZER LEAP minimizes diamond breakage, preserving the integrity of each precious stone throughout the sawing process.

Minimum Weight Loss
Ensure minimal weight loss during diamond processing, maximizing the yield and value of the finished products with LAZER LEAP.

Smooth Surface
LAZER LEAP delivers a flawless finish with a smooth surface, meeting the highest standards of quality in diamond sawing operations.

User-friendly and Smart Software
Empower your diamond processing experience with LAZER LEAP's smart and user-friendly software, streamlining operations for enhanced efficiency and precision.

Download Lazer Leap brochure


  • Dimension: 0.76m (2’6”) x 1.20m (3’11”) x 1.50m (4’11”) (L x W x H)

  • Weight: Approx. 300kg (661.3 lbs)

  • Axis Travel: 130mm (X), 130mm (Y), 60mm (Z)

  • Laser Profile: Nd Yag @1064nm (IR) @532nm(GRN), TEMoo – Diode Pumped Solid State

  • Operating Voltage: Single Phase, 230 VAC, 12Amps, 50/60Hz

  • Output Power: IR@1064 nm > 20W@10KHz, Green@532nm > 15W@7KHz

  • Available in Green Laser and Infrared variants.

Diamond Sawing

Diamond Slicing

Diamond Coring